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Hot Melt Molding - List of Manufacturers, Suppliers, Companies and Products

Hot Melt Molding Product List

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Hot Melt Molding Case Study: "Internal Wiring of Enclosures"

Hot Melt Molding Case Study: "Internal Wiring of Enclosures"

We solved the request to tidy up the internal wiring of the enclosure with hot melt molding!

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. In this catalog, we introduce examples that address the desire to tidy up the internal wiring of small devices using hot melt molding technology. [Challenges] - Poor organization of internal wiring - When users open the housing for battery replacement, the appearance is not good [Benefits] - Fixing the harness in any shape with hot melt molding *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Other electronic parts
  • Coating Agent

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Hot Melt Molding Case Study: "Waterproof Sealing of Printed Circuit Boards"

Hot Melt Molding Case Study: "Waterproof Sealing of Printed Circuit Boards"

Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.

Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*

  • Processing Contract
  • Other electronic parts
  • Coating Agent

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Hot melt molding

Hot melt molding

Due to low temperature, low pressure, and low-speed molding, there is less stress on electronic components and printed circuit boards!

"Hot Melt Molding" is a molding technology using adhesive-based resins (polyamide, polyester, polyolefin). It is suitable for protecting substrates and electronic components using one-component thermoplastic resins. Due to its high adhesive strength, it excels in waterproofing, drip-proofing, and dust-proofing, and the molds can be smaller, which helps reduce initial costs. 【Features】 ■ Minimal stress on electronic components and printed circuit boards ■ Excellent waterproofing, drip-proofing, and dust-proofing due to high adhesive strength ■ Smaller molds help reduce initial costs ■ Resolves surface irregularities and void issues during potting *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.

Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.

  • plastic
  • Coating Agent
  • Other electronic parts

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Waterproof sealing of substrates, sensors, etc. Hot melt molding.

Waterproof sealing of substrates, sensors, etc. Hot melt molding.

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

  • EMS
  • Coating Agent

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For waterproofing and dustproofing of electrical components. Hot melt molding.

For waterproofing and dustproofing of electrical components. Hot melt molding.

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

  • Processing Contract
  • Coating Agent
  • Other electronic parts

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[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding

[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

  • plastic
  • Coating Agent
  • Other electronic parts

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Hot Melt Molding Case Study: "Waterproof Connector"

Hot Melt Molding Case Study: "Waterproof Connector"

Introduction to the hot melt molding method that completes 4 waterproof connectors in 30 seconds.

Hot melt molding is a molding technique that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce examples of process improvement and value analysis through the switch from waterproof connector rubber bushings. [Challenge] We want to waterproof the wire insertion area. *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Automotive Connectors

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Waterproof sealing of electrical components: Hot melt molding

Waterproof sealing of electrical components: Hot melt molding

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

  • Coating Agent
  • Circuit board design and manufacturing
  • Other electronic parts

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